On Aug. 8, 2024, JPN TKY MET said Seibu Shinkin Bank will participate in the program to support fundraising of SMEs working on business succession, via private bonds.
The deadline for SMEs to apply for subsidies is Feb. 28, 2025.
JPN TKY MET began to support fundraising via use of SME private placement bonds.
Aims to promote smooth business succession at small and medium-sized enterprises.
Will work together with relevant FIs to support SMEs working on business succession.
Issuance Fee Subsidies
Release covers, e.g., associated subsidies being offered, eligibility criteria for business operators, level of subsidies, financial institutions (FIs) involved, application deadline.
Aug. 2024 Project for 2024
On Aug. 8, 2024, JPN TKY MET said Seibu Shinkin Bank will participate in the program to support fundraising of SMEs working on business succession, via private bonds.
The deadline for SMEs to apply for subsidies is Feb. 28, 2025.
