On Nov. 15, CHI NAFMII issued bond underwriting evaluation 2024.
CHI NAFMII issued Market evaluation for members applying to engage in underwriting related business for non-financial corporate debt financing instruments in 2024.
Follows CHI NAFMII Dec. 2023 issued notice re bond market evaluation, see #193510.
Evaluation Overview
The evaluation targets include non-financial corporate debt financing instrument underwriting members and potential underwriting members.
Specifies circumstances where members cannot participate in the evaluation including those that have been subject to criminal penalties/major supervision measures.
Specifies the evaluation standards for applying members, local banks, securities firms, foreign banks, foreign financial institutions, applying members for underwriting technological innovation non-financial enterprise debt financing instruments.
Effectiveness
Participating members shall submit relevant materials CHI NAFMII by Nov. 28, 2024.
